Re: "Drexlerian" as an epithet, was Re: Saul Kent's powerful newcryonics organization

From: Doug Jones (
Date: Fri Feb 15 2002 - 11:09:38 MST

Mike Lorrey wrote:
> "Robert J. Bradbury" wrote:
> >
> > Michael Butler wrote:
> > > It seems that one must deal with the notion that self-replicating general
> > > purpose assemblers is Drexler's sole contribution/albatross;
> >
> > I don't consider that to be the case. If one reads Nanosystems
> > and Eric's other papers carefully there are a huge number of
> > other things discussed. A few would include -- snip..
> > the fact that heat removal is the *real*
> > problem for high computation densities,
> I'm wondering why chip companies are not looking at building MEMS
> cooling systems into chips, and why they are not already designing
> cooling ports into the chips. A number of evenly spaced venturi ports
> across the chip face for the fan to draw air through should provide a
> significant increase in cooling. As chip designs get thicker, this will
> be a very necessary design feature.

There's an outfit in Los Alamitos (yet another LA suburb) that builds
copper etched-film laminate devices, mostly for active cooling of laser
diodes. They built a combustion chamber for RotRock which I supervised
the testing of at 3000 lb thrust... I haven't heard any proposals for
making labyrinth cooling in silicon- if feasible it might be a good
improvement, and cheaper than attaching a separate copper heat
exchanger. Liquid coolant would be superior to air, partly due to
better heat exchange, partly because the coolant could be kept cleaner
than air.

See for details.

Doug Jones, Rocket Plumber
XCOR Aerospace

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