From: Eugene Leitl (Eugene.Leitl@lrz.uni-muenchen.de)
Date: Fri Feb 15 2002 - 10:01:18 MST
On Fri, 15 Feb 2002, Mike Lorrey wrote:
> I'm wondering why chip companies are not looking at building MEMS
> cooling systems into chips, and why they are not already designing
> cooling ports into the chips. A number of evenly spaced venturi ports
For the same reason they don't design memory-CPU blocks bonded with heat
dissipation + networking, all in a handy pluggable module. Customers
apparently don't want it. AMD is losing credibility with the user base
right now, though, because it doesn't offer thermal protection. A naked
AMD CPU would self-destruct in less than a second.
> across the chip face for the fan to draw air through should provide a
> significant increase in cooling. As chip designs get thicker, this will
> be a very necessary design feature.
Copper and diamond heat spreaders should be there quite soon, and advent
of liquid cooling is unavoidable. Voltage and structure shrink still gives
us some headway, but current designs are rapidly getting uncomfortably
hot. Asynchronous designs and power saving should do better, and even
reversible logic in semiconductors, eventually.
Latter is a must for computronium, of course.
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